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Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications

04/30/2024 | Indium Corporation
Indium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.

Boeing Opens Research & Technology Center in Japan

04/23/2024 | Boeing
 Boeing today opened a Boeing Research & Technology (BR&T) Center in Japan that will focus on innovation to enable the commercial aviation industry meet its goal of net zero carbon emissions by 2050.

Ansys Joins BAE Systems’ Mission Advantage Program to Advance Digital Engineering Across US Department of Defense

04/16/2024 | ANSYS
Ansys announced it is working with BAE Systems, Inc., to accelerate the adoption of digital engineering and MBSE across the Department of Defense (DoD).

Mark Schulman Rocks Zuken Innovation World + integrate24

04/10/2024 | Zuken
Zuken USA, Inc. is excited to announce that the renowned drummer and motivational speaker, Mark Schulman, will be the keynote speaker at this year's Zuken Innovation World Americas (ZIW) conference, co-located with integrate24. Scheduled for September 17-19, 2024, in the vibrant city of Cleveland, Ohio, the conference aims to bring together the brightest minds in the PCB, Wire Harness, and Digital Engineering fields.

Saab Announces Plans for New Munitions Facility in U.S.

04/03/2024 | Saab
Saab announced plans to build a new munitions facility in the U.S., continuing the company’s strong investment and growth domestically.
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