-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueLevel Up Your Design Skills
This month, our contributors discuss the PCB design classes available at IPC APEX EXPO 2024. As they explain, these courses cover everything from the basics of design through avoiding over-constraining high-speed boards, and so much more!
Opportunities and Challenges
In this issue, our expert contributors discuss the many opportunities and challenges in the PCB design community, and what can be done to grow the numbers of PCB designers—and design instructors.
Embedded Design Techniques
Our expert contributors provide the knowledge this month that designers need to be aware of to make intelligent, educated decisions about embedded design. Many design and manufacturing hurdles can trip up designers who are new to this technology.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - design007 Magazine
Design Community Town Hall Review
April 11, 2024 | Kelly Dack, CID+, EPTACEstimated reading time: 2 minutes
There’s been a lot of work going on at IPC related to PCB design training and education. This week, many new members of IPC’s design groups met up in person at IPC APEX EXPO.
The Design Community Town Hall took place on the afternoon of April 10, 2024. I was fortunate to attend this event, which marked an opportunity for members of some newly found design groups to get together and exchange ideas. Peter Tranitz, senior director of solutions for IPC, opened the session with a slide presentation introducing these new groups and members within the solutions department.
The Design Leadership Council includes 14 members:
Steve Watt (Zuken), Steven Roy (Optimum Design Associates), Dale Lee (Plexus), Pietro Vergine (Leading Edge), Savita Ganjigatti (Sienna ECAD Technologies), Thomas Romant (IPC Designers Council France), Ellefen Jiang (NCAB), Kevin Kusiak (Lockheed Martin), Susan Kayesar (Siemens), Jesus Castane (MBDA), John Watson (Altium), Igor Bulavitchi (Flex), Flayover Guo, and Huseyin Ariac.
The Global IPC Internal Design Team (GIDT) includes 16 members:
Matt Kelly (Sponsor), Mike Milostan (Marketing), Barry Matties (I-Connect007), Andy Shaughnessy (I-Connect007), Carlos Plaza (Education), Teresa Rowe (Standards), Kelly Scanlon (Sustainability), John Perry (Standards), Peter Tranitz (Initiative Coordinator), Patrick Crawford (Standards), Francisco Fourcade (Standards), Andres Ojalill (Standards), Kris Moyer (Education), Lorena Villanueva (Mexico), Shine Yang (China/Asia), and Saurabh Saxena (India).
These new groups are poised to tackle a variety of challenges as IPC pivots to fill gaps in the design and manufacturing knowledge pool due to the ongoing retirement of our senior subject matter experts.
Tranitz then extended “kudos” to these group members. He emphasized that their “1,000 years of combined knowledge” will come in handy as the groups work and collaborate going forward. He emphasized the need to address critically needed updates in educational training programs as well as design and manufacturing standards and guidelines.
The second half of the meeting included a panel discussion moderated by Susan Kayesar, product manager for PCBflow at Siemens. The panel focused on some soon-to-be published white papers on several key design topics involving CAD data, DFM and stakeholder usage and accessibility. The event wrapped up with a rousing Q&A session. PCB designers and design engineers in the audience were not shy about sharing their opinions.
If you’re a subject matter expert on PCB design, consider getting involved with IPC’s design teams. They will welcome you with open arms, and you’ll probably learn something along the way.
Suggested Items
iNEMI Packaging Tech Topic Series: Role of EDA in Advanced Semiconductor Packaging
04/26/2024 | iNEMIAdvanced semiconductor packaging with heterogenous integration has made on-package integration of multiple chips a crucial part of finding alternatives to transistor scaling. Historically, EDA tools for front-end and back-end design have evolved separately; however, design complexity and the increased number of die-to-die or die-to-substrate interconnections has led to the need for EDA tools that can support integration of overall design planning, implementation, and system analysis in a single cockpit.
Cadence, TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
04/25/2024 | Cadence Design SystemsCadence Design Systems, Inc. and TSMC have extended their longstanding collaboration by announcing a broad range of innovative technology advancements to accelerate design, including developments ranging from 3D-IC and advanced process nodes to design IP and photonics.
Ansys, TSMC Enable a Multiphysics Platform for Optics and Photonics, Addressing Needs of AI, HPC Silicon Systems
04/25/2024 | PRNewswireAnsys announced a collaboration with TSMC on multiphysics software for TSMC's Compact Universal Photonic Engines (COUPE). COUPE is a cutting-edge Silicon Photonics (SiPh) integration system and Co-Packaged Optics platform that mitigates coupling loss while significantly accelerating chip-to-chip and machine-to-machine communication.
Siemens’ Breakthrough Veloce CS Transforms Emulation and Prototyping with Three Novel Products
04/24/2024 | Siemens Digital Industries SoftwareSiemens Digital Industries Software launched the Veloce™ CS hardware-assisted verification and validation system. In a first for the EDA (Electronic Design Automation) industry, Veloce CS incorporates hardware emulation, enterprise prototyping and software prototyping and is built on two highly advanced integrated circuits (ICs) – Siemens’ new, purpose-built Crystal accelerator chip for emulation and the AMD Versal™ Premium VP1902 FPGA adaptive SoC (System-on-a-chip) for enterprise and software prototyping.
Listen Up! The Intricacies of PCB Drilling Detailed in New Podcast Episode
04/25/2024 | I-Connect007In episode 5 of the podcast series, On the Line With: Designing for Reality, Nolan Johnson and Matt Stevenson continue down the manufacturing process, this time focusing on the post-lamination drilling process for PCBs. Matt and Nolan delve into the intricacies of the PCB drilling process, highlighting the importance of hole quality, drill parameters, and design optimization to ensure smooth manufacturing. The conversation covers topics such as drill bit sizes, aspect ratios, vias, challenges in drilling, and ways to enhance efficiency in the drilling department.