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SiC & GaN Power Semiconductor Market Accelerates at 22.9% CAGR to Reach $11.08 Billion by 2034

05/27/2024 | PRNewswire
According to a new industry report by Fact.MR, the global SiC & GaN Power Semiconductor Market is expected to reach a valuation of US$ 1.41 billion in 2024. It is projected to achieve $11.08 billion by 2034, growing at a CAGR of 22.9% from 2024 to 2034.

Siemens Simplifies Development of AI Accelerators for Advanced System-on-chip Designs with Catapult AI NN

05/24/2024 | Siemens
Siemens Digital Industries Software announced Catapult™ AI NN software for High-Level Synthesis (HLS) of neural network accelerators on Application-Specific Integrated Circuits (ASICs) and System-on-a-chip (SoCs). Catapult AI NN is a complete solution that starts with a neural network description from an AI framework, converts it into C++ and synthesizes it into an RTL accelerator in Verilog or VHDL for implementation in silicon.

Listen to I-Connect007’s Latest Podcast Episode: Empowering Electrical Engineers

05/23/2024 | I-Connect007
I-Connect007 is thrilled to announce the release of the latest episode in Series 3 of its popular podcast, On the Line With... , available now on Apple and Spotify.

The Rise of Collaborative Intelligence in Manufacturing

05/22/2024 | Jennifer Davis, Arch Systems
Every modern manufacturer grapples with a common challenge: extracting actionable insights from the ever-growing sea of operational data. The challenge of the data deluge isn’t just overwhelming; it coincides with a broader shift in automation needs. While traditional forms of automation, such as robots, remain vital, the focus is expanding to encompass automating the very intelligence needed to run a factory efficiently. As a result, a new generation of tools and technologies, including artificial intelligence (AI) is beginning to transform the way factories operate.

Molex Releases Report on Thermal Management Challenges and Opportunities for I/O Modules

05/22/2024 | PRNewswire
Molex, a global electronics leader and connectivity innovator, has published a report that examines thermal management pitfalls and possibilities as data center architects and operators strive to balance high-speed data throughput requirements with the impacts of growing power density and the need for heat dissipation on critical servers and interconnect systems.
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