-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Growing Industry
In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
The Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
Upcoming 2019 Trade Show Season in the USA
December 19, 2018 | Dan Feinberg, Technology Editor, I-Connect007Estimated reading time: 10 minutes
Figure 6: CES 2015 exhibition.
Of the over 4,400 official exhibitors, CES states that the Eureka Park marketplace, which is for startups, will have more than 1,000 exhibitors this year. Overall, the exhibit space at the official CES halls, pavilions, and suites is expected to be over 2,700,000 square feet spread over multiple exhibition buildings, locations, and hotels across the city (Figures 7 and 8). The number of attendees is expected to approach 200,000 with over 60,000 from outside the U.S. Any tech company who is anybody will be there unless they have an ego that is beyond stupidity or just do not have the resources. I will be one of over 4,200 media in attendance with more than half coming from outside the U.S.
Figure 8: Navigating CES table.
No one can cover this event single-handedly, so Racheal Feinberg will join me again this year as our photographer, along with Nolan Johnson, I-Connect007’s managing editor for SMT007 and PCB007, who will attend CES for the first time, which significantly expands our coverage. We will focus on disruptive technologies and devices that will have an impact on electronics design, fabrication, and assembly. As usual, we will see devices and technology that are just plain amazing and interesting.
Page 3 of 4
Suggested Items
KIC’s Miles Moreau to Present Profiling Basics and Best Practices at SMTA Wisconsin Chapter PCBA Profile Workshop
01/25/2024 | KICKIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, announces that Miles Moreau, General Manager, will be a featured speaker at the SMTA Wisconsin Chapter In-Person PCBA Profile Workshop.
The Drive Toward UHDI and Substrates
09/20/2023 | I-Connect007 Editorial TeamPanasonic’s Darren Hitchcock spoke with the I-Connect007 Editorial Team on the complexities of moving toward ultra HDI manufacturing. As we learn in this conversation, the number of shifting constraints relative to traditional PCB fabrication is quite large and can sometimes conflict with each other.
Standard Of Excellence: The Products of the Future
09/19/2023 | Anaya Vardya -- Column: Standard of ExcellenceIn my last column, I discussed cutting-edge innovations in printed circuit board technology, focusing on innovative trends in ultra HDI, embedded passives and components, green PCBs, and advanced substrate materials. This month, I’m following up with the products these new PCB technologies are destined for. Why do we need all these new technologies?
Experience ViTrox's State-of-the-Art Offerings at SMTA Guadalajara 2023 Presented by Sales Channel Partner—SMTo Engineering
09/18/2023 | ViTroxViTrox, which aims to be the world’s most trusted technology company, is excited to announce that our trusted Sales Channel Partner (SCP) in Mexico, SMTo Engineering, S.A. de C.V., will be participating in SMTA Guadalajara Expo & Tech Forum. They will be exhibiting in Booth #911 from the 25th to the 26th of October 2023, at the Expo Guadalajara in Jalisco, Mexico.
Intel Unveils Industry-Leading Glass Substrates to Meet Demand for More Powerful Compute
09/18/2023 | IntelIntel announced one of the industry’s first glass substrates for next-generation advanced packaging, planned for the latter part of this decade.