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Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4

06/05/2024 | Happy Holden -- Column: Happy’s Tech Talk
A special case of rigid board applications is when you would like to bend the board but don’t need it to flex. We have called this case “bend-to-install” or sometimes “semi-flex”. Many electronics applications are in this class of assembly, as illustrated: Rigid board needing height adjustments, automotive lighting, industrial cameras, engine control units, and and-held portable units.

New SEMI Foundation Semiconductor PRIDE Initiative to Promote LGBTQ+ Inclusion in Chip Industry Workforce

06/04/2024 | SEMI
The SEMI Foundation, the non-profit arm of SEMI, today announced the formation of a new industry-led initiative to advance LGBTQ+ inclusion in the semiconductor workforce.

Teledyne Brown Engineering Selected for Natrium Project

06/04/2024 | Teledyne
Teledyne Brown Engineering, Inc., a subsidiary of Teledyne Technologies Incorporated, has been selected by TerraPower as a supplier for the Natrium™ Reactor Demonstration Project in Kemmerer, Wyoming.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week 

05/31/2024 | Marcy LaRont, PCB007 Magazine
This week, our columnists enjoy particular attention with Barry Olney, Mehul Dave, and Happy Holden all providing valuable insight on materials, the critical importance of the front-end engineering process once a PCB design is received, and an overview and observations around IPC APEX EXPO technical sessions.

Bell Awarded Funding for Phase 1B of DARPA Speed and Runway Independent Technologies (SPRINT) X-Plane Program

05/30/2024 | Bell
Bell Textron Inc., a Textron Inc. company, has been down-selected for Phase 1B of Defense Advanced Research Projects Agency (DARPA) Speed and Runway Independent Technologies (SPRINT) X-Plane program.
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