Designer’s Notebook: What Designers Need to Know About Manufacturing, Part 2
The Pulse: Drilling Down on Documentation
Connect the Dots: Designing for Reality: Prioritizing ManufacturabilityUHDI Fundamentals: Talking UHDI with John Johnson, Part 1
November 21, 2023 | Steve Williams, The Right Approach Consulting LLCEstimated reading time: 1 minute
American Standard Circuits is an early adopter of Averatek’s A-SAP process for its ultra-high definition interconnect (UHDI) products. I sat down with industry veteran John Johnson to discuss this. John, vice president of business development, oversees quality at American Standard Circuits, and previously worked at Averatek. In the spirit of full disclosure, we will be discussing and sharing photos, slides, and materials with permission from both ASC and Averatek. This is the first of a three-part interview.
Steve Williams: Welcome John, good to see you again.
John Johnson: Thank you, Steve. It’s my pleasure. I’m always looking to talk about UHDI and the A-SAP process.
Williams: What does A-SAP stand for? What does it mean?
Johnson: The A in A-SAP stands for Averatek, and of course, SAP is a semi-additive process. So it's an Averatek semi-additive process they've developed for the electronics industry, predominantly circuit boards.
Williams: Very good. You've had a lot of leadership positions in the industry, but before American Standard, you worked at Averatek?
Johnson: I was the vice president of sales and customer support, and, predominantly, my role was working with the licensees to get them up and running, to bring product realization to the forefront with them.
To read this entire conversation, which appeared in the November 2023 issue of Design007 Magazine, click here.
Share on:
Suggested Items
Cadence Partners with Antiviral Discovery Consortium to Spearhead Rapid Development of Treatments for Viral Pandemics
12/08/2023 | Cadence Design Systems, Inc.Cadence Molecular Sciences (OpenEye)—a business unit of Cadence Design Systems—will provide OpenEye’s molecular design software to power the open-science AI-driven Structure-enabled Antiviral Platform (ASAP) Discovery Consortium in support of an innovative effort to rapidly develop antivirals to prevent future pandemics.
10 Steps to Outstanding
09/06/2023 | Dan Beaulieu, D.B. Management GroupSo often when I talk to PCB shop owners, they ask me how they can be outstanding. How can they position their own company to stand out from the crowd? That’s because one of the issues PCB shops face these days is they all seem to be alike. While they used to be judged and differentiated based on performance, now they all have very good quality.
The Growing Need for UHDI
11/30/2022 | I-Connect007 Editorial TeamJan Pedersen of NCAB Group is deeply involved in IPC standards development surrounding ultra HDI and keeps his finger on the pulse of the industry surrounding this type of fabrication. With Asia still dominating this area, Jan sees the need for U.S. and European PCB fabricators to make the investment if they want to stay competitive.
Arbell Electronics to Represent Kurtz Ersa Stencil Printers Across Canada
09/27/2022 | Kurtz Ersa Inc.Kurtz Ersa Inc., a leading supplier of electronics production equipment, is pleased to announce that it has appointed Arbell Electronics as its newest manufacturers‘ representative for its award-winning line of VERSAPRINT stencil printers.
PCB Talk: Additive Electronics—Are You One of the Curious?
10/29/2021 | Tara Dunn -- Column: PCB TalkThe term “additive electronics” is a broad term in our industry. To many this suggests 3D printing and the processes used to form circuit patterns with these additive methods. To others, this term conjures the image of newer PCB fabrication techniques that use semi-additive PCB fabrication processes to realize line width and space below the traditional 75-micron (3 mil) capabilities that are typically seen with subtractive etch processing.