ULVAC Launches NA-1500 Dry Etching System for 600mm Advanced Packaging Substrate
March 21, 2017 | JCN NewswireEstimated reading time: 1 minute
ULVAC, Inc. is pleased to introduce the NA-1500 dry etching system for 600mm advanced packaging substrates, providing for uniform Descum and Ti etching processes.
Higher data transfer speeds require high-density packaging technologies, while advanced mobile and wireless devices require thinner and higher-pin-count IC packages. Fan-Out Wafer Level Packaging (FO-WLP) is widespread, while Panel Level Packaging increases substrate size from 300mm to 600mm.
While there are many 200mm/300mm wafer dry etching systems in the market today, there was no dry etching system for 600mm substrate, providing for a uniform Descum process and Ti etching process. ULVAC developed the new system to address this need, and support mass-produced packaging processes.
The new NA-1500 dry etching system is made possible by enhancing our proven plasma source. Our plasma source enables fast, low-temperature etching in the resin layer, which had been previously impossible with existing CCP methods.
Our plasma source is also applicable to fluorine gases, so seed layer Ti etching, which requires a wet process, can proceed without side etching. SiO2 and SiN etching is available on the NA-1500 as well.
The NA-1500 dry etching system also provides stable transfer and processes without abnormal discharge, ensuringing warpage from the enlarged substrate is never an issue.
Applications:
1. Descum
2. Desmear
3. Surface treatment (Hydrophobicity <-> Hydrophilicity)
- Pretreatment for wet process such as plating, etc.
- Pretreatment for underfill
4. Resin material ashing
5. Seed layer Ti etching
6. SiO2/SiN etching
Our Future:
ULVAC has sold more than 200 dry etching systems since releasing our first 200mm wafer system 20 years ago. As electronic components become smaller and thinner, and higher-speed processing works on lower power in line with developments in IoT, manufacturing technologies for advanced packaging become more important. ULVAC supports this industry by providing systems that meet customer's future needs for flexible, invisible and wearable devices.
About ULVAC, Inc.
ULVAC, Inc., is a Japan-based vacuum equipment manufacturer. ULVAC was founded in 1952 and has contributed to development of industry and technology through comprehensive use of vacuum technology and its peripheral technology. We created "ULVAC SOLUTIONS" based on our one of a kind technologies built upon long years of research, development, and production technology innovations. We offer this solution composed of equipment, materials, analytic evaluation, vacuum components and other various services, for flat panel displays, solar cells, semiconductors, electronic components, and general industrial equipment.
Suggested Items
Orbex Secures £16.7m Investment for Rocket ‘Ramp Up’ Period
04/24/2024 | OrbexThe UK spaceflight company Orbex has received £16.7m from six backers in an update to its Series C funding round.
Real Time with... IPC APEX EXPO 2024: Going Vertical: SCHMID's Advanced Solutions for Printed Circuit Boards
04/24/2024 | Real Time with...IPC APEX EXPOEditor Marcy LaRont chats with Bob Ferguson, the president of SCHMID, about advanced solutions for PCBs and the equipment they are highlighting at this year's show. He delves into vertical no-touch handling systems and the prospect of achieving sub-10-micron lines. Inspired by SCHMID's technology, Bob expresses excitement about where the industry is today.
Real Time with... IPC APEX EXPO 2024: Advancements in Laser Depaneling with LPKF
04/24/2024 | Real Time with...IPC APEX EXPOJake Benz, LPKF sales manager for North America, discusses the company's advancements in laser depaneling. LPKF has introduced a green wavelength laser for processing rigid FR-4 circuit boards, bringing significant gains in processing speeds to market. The company transitioned from IR CO2 to UV wavelength due to heat and burning issues.
Adura Solutions Exhibits at Del Mar 2024
04/24/2024 | Adura SolutionsSumit Tomar, CEO of Adura Solutions, has announced that his company will be exhibiting at this year’s Del Mar Electronics and Manufacturing Show to be held at the Del Mar Fairgrounds, San Diego, California, April 24-25.
Winner of The Science Show Rakett 69 Receives Incap Scholarship
04/24/2024 | IncapThe winner of the Rakett 69 science show, Andri Türkson, who stood out as an electronics enthusiast, received a scholarship from Incap Estonia, along with an internship opportunity in Saaremaa.