Improving Silver Nanowires for FTCEs with Flash Light Interactions
April 7, 2017 | KAISTEstimated reading time: 1 minute
Flexible transparent conducting electrodes (FTCEs) are an essential element of flexible optoelectronics for next-generation wearable displays, augmented reality (AR), and the Internet of Things (IoTs). Silver nanowires (Ag NWs) have received a great deal of attention as future FTCEs due to their great flexibility, material stability, and large-scale productivity. Despite these advantages, Ag NWs have drawbacks such as high wire-to-wire contact resistance and poor adhesion to substrates, resulting in severe power consumption and the delamination of FTCEs.
A research team led by Professor Keon Jae Lee of the Materials Science and Engineering Department at KAIST and Dr. Hong-Jin Park from BSP Inc., has developed high-performance Ag NWs (sheet resistance ~ 5 Ω/sq, transmittance 90 % at λ = 550 nm) with strong adhesion on plastic (interfacial energy of 30.7 J∙m-2) using flash light-material interactions.
The broad ultraviolet (UV) spectrum of a flash light enables the localized heating at the junctions of nanowires (NWs), which results in the fast and complete welding of Ag NWs. Consequently, the Ag NWs demonstrate six times higher conductivity than that of the pristine NWs. In addition, the near-infrared (NIR) of the flash lamp melted the interface between the Ag NWs and a polyethylene terephthalate (PET) substrate, dramatically enhancing the adhesion force of the Ag NWs to the PET by 310 %.
Professor Lee said, “Light interaction with nanomaterials is an important field for future flexible electronics since it can overcome thermal limit of plastics, and we are currently expanding our research into light-inorganic interactions.”
Meanwhile, BSP Inc., a laser manufacturing company and a collaborator of this work, has launched new flash lamp equipment for flexible applications based on the Professor Lee’s research.
Suggested Items
OE-A at LOPEC: Printed Electronics Powers Sustainability
02/06/2024 | OE-AThe “OE-A Competition 2024” shows the many possibilities of flexible, organic, and printed electronics with inspiring products, prototypes, and fresh designs live at LOPEC 2024, the leading international exhibition and conference for flexible, organic, and printed electronics in Munich.
All Flex Solutions Invests in New Flexible Circuit Facility
02/05/2024 | All Flex SolutionsAll Flex Solutions has started the equipment build-out of a completely new flexible circuit manufacturing facility in Minneapolis. The building was purchased in 2020, and was completely renovated to accommodate the company’s plans for a brand new state-of-the-art flexible circuit fabrication plant.
Flexible Printed Circuits: A Design Primer
12/19/2023 | Chris Keirstead, PFC Flexible CircuitsFlexible circuits consist of conductive strips in a sandwich of insulating or dielectric material. They resist moisture and contamination and are insulated from external shorts, with holes or contact surfaces for interconnection. Understanding a package’s electrical requirements and not over-designing permits means taking full advantage of a flexible circuit’s potential compared to conventional wiring.
Intel Technology Helps Power Solution for a More Resilient Grid
11/29/2023 | IntelAhead of Enlit Europe, Intel announced that its technology is helping power the Edge for Smart Secondary Substations (E4S) Alliance’s new solution to modernize the energy grid.
Würth Elektronik Launches Research Project HyPerStripes
11/27/2023 | Wurth ElektronikHyPerStripes project partners will create a technology platform including manufacturing techniques for roll-to-roll (R2R) processing as well as the integration of electronic components onto very long ("endless"), flexible and stretchable printed circuit boards.