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- Call for Papers for EIPC Winter Conference Lyon, France, February 1–2, 2018
- SMT Hybrid Packaging 2018: Call for Tutorials Launched
- Schweizer Electronic AG: Preliminary Figures for the First Half Year 2017 and Adjustment of Forecast
- IoT Growth Slower than Expected
- Made in China 2025: Make or Break for Europe?
- Forthcoming SMART Dates for 2017
- IMAPS News for July 2017.... Holiday Time is Coming!
- The "RELPACK" Reliability Conference
- Ventec's Martin Cotton Joins Speaker Line-up at Advancements in Thermal Management Conference 2017
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