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iNEMI to Hold Webinar on Copper Foil Surface Treatment Assessment
May 26, 2021 | iNEMIEstimated reading time: 1 minute
The treatments typically used on copper foils are often essential for PCBs to survive thermal shock. However, the same treatments can have a detrimental effect on signal loss for high frequency/5G applications which require very low-profile copper foil and low-loss resin systems for optimum electrical performance.
iNEMI will be holding a call-for-participation webinar on May 27 and 28 to present how the Reliability & Loss Properties of Copper Foils for 5G Applications team plans to characterize various copper surface treatments to mitigate signal loss while still maintaining good adhesion and, hence, durability of the PCB.
iNEMI will review the increasing requirements for smooth copper to minimize signal loss within PCB structures, and how this smooth copper can be a challenge to reliability. In addition, the team plans a comparative study to determine signal loss from copper roughening by the pre-bonding chemical treatment during PCB fabrication (oxide alternative process). Ongoing developments in PCB material, fabrication and metrology will also be described.
The overall objective of the project will be to correlate surface finish to durability to signal loss in order to optimize the design and qualification of PCBs for future high-speed applications.
The sessions are open to industry; advance registration is required. For additional information about this project, contact Steve Payne at steve.payne@inemi.org.
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Trouble in Your Tank: Supporting IC Substrates and Advanced Packaging, Part 5
03/19/2024 | Michael Carano -- Column: Trouble in Your TankDirect metallization systems based on conductive graphite or carbon dispersion are quickly gaining acceptance worldwide. Indeed, the environmental and productivity gains one can achieve with these processes are outstanding. In today’s highly competitive and litigious environment, direct metallization reduces costs associated with compliance, waste treatment, and legal issues related to chemical exposure. What makes these processes leaders in the direct metallization space?
AT&S Shines with Purest Copper on World Recycling Day
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Matrix to Exhibit at IPC APEX EXPO 2024 in Anaheim, CA
03/05/2024 | MatrixMatrix will be exhibiting at IPC APEX EXPO 2024, to be held on April 9-12, 2024, at the Anaheim Convention Center, Anaheim, CA.
The Chemical Connection: Getting to Know Your Vendor
02/16/2024 | Don Ball -- Column: The Chemical ConnectionAfter working for a capital equipment supplier for almost 50 years, I’ve found that the most important part of getting to know your vendor is good communication among all parties. While contact between fabricators of a constantly changing product line and the designers of those products may occur daily or weekly, conversations between you and your equipment supplier may be years apart. That lengthy gap often means that previous contacts may have been promoted, retired, or moved on to other opportunities. You may have also migrated to a new supplier with whom you have little or no history. In either case, you will be interacting with someone you are unfamiliar with (as they are with you). Therefore, it is essential for both sides to communicate clearly so expectations will align.
EIPC Winter Conference 2024, Day 2: A Closer Look at Global Trends
02/14/2024 | Pete Starkey, I-Connect007The opening session of the second day’s conference proceedings focused on global PCB trends and was introduced and moderated by Dr. Michele Stampanoni, vice president of strategic sales and business development at Cicor Group in Switzerland. He opened the session with Dr. Hayao Nakahara’s knowledgeable and enlightening video presentation on the IC substrates industry.