Ambarella, Lumentum, ON Semiconductor Collaborate on 3D Sensing
May 26, 2021 | Globe NewswireEstimated reading time: 2 minutes
Ambarella, Inc., an AI vision silicon company, Lumentum, a market-leading designer and manufacturer of innovative optical and photonic products, and ON Semiconductor®, a leading provider of CMOS image sensor solutions, announced two new joint reference designs that accelerate AIoT device deployment across verticals, building on the companies’ previous joint solution for contactless access systems. By combining the data from Lumentum’s high-performance VCSEL array illuminators and an ON Semiconductor image sensor using Ambarella’s AI SoC, higher levels of accuracy and more intelligent decision-making can be achieved in next-generation AIoT devices for biometric access control, 3D electronic locks and other intelligent sensing applications.
Originally intended for biometric access control and electronic locks, these new reference designs can also address the needs of smart cities, smart buildings, smart homes and intelligent healthcare. Additionally, the high level of integration provided by these joint solutions significantly lowers system power consumption and thermal design requirements while enabling much smaller product form factors.
“Ambarella’s vision is to combine AI processing with 3D and vision sensing to create an ambient intelligent future,” said Fermi Wang, President and CEO of Ambarella. “This collaboration with Lumentum and ON Semiconductor will further advance the convergence of AI and IoT to enable a new generation of access control systems, while inspiring novel categories of ambient sensing products—all powered by the fusion of sensors using AI vision processors that interact intelligently and unobtrusively with people to address their ever-evolving needs.”
“Our new joint solutions will greatly increase the accuracy of AIoT devices across application verticals—starting with biometric access control and electronic locks—enabling them to recognize people and predict their needs, rather than requiring a direct human interface,” said Téa Williams, Senior Vice President and General Manager, 3D Sensing of Lumentum. “Many of these applications will take advantage of 3D sensing to inject a new dimension of data input for improved decision-making. As an example, using higher resolution VCSEL-based spot illumination enables longer sensing ranges and higher-accuracy facial recognition. Lumentum’s industry-leading and high-performance VCSEL arrays with zero field failures, used across these joint solutions, are driving new applications and helping realize the dream of AIoT devices with 3D sensing capabilities.”
“Image sensors are the eyes for intelligent sensing devices. Their ability to see farther with more detail provides significantly more information for the AI processor’s decision-making in AIoT devices,” said Gianluca Colli, Vice President and General Manager, Industrial and Consumer Sensor Division (ICSD) group at ON Semiconductor. “Our industry leading RGB-IR sensor technology, combined with the advanced ISP capabilities of Ambarella’s AI vision SoCs, can bring both visible and IR images into devices simultaneously. For this second generation of our joint solutions, we leveraged customer feedback to quadruple the resolution of our RGB-IR image sensors to 4K (8MP).”
Suggested Items
SEMI Applauds CHIPS Program Office Progress to Diversify U.S. Semiconductor Industry Workforce
04/18/2024 | SEMIThe SEMI Foundation, the arm of SEMI dedicated to supporting economic opportunity for workers and the sustained growth of the microelectronics industry by creating pathways and opportunities for job seekers, applauded strides made by the CHIPS Program Office to diversify the U.S. semiconductor industry workforce and its release of the First Annual Report Regarding the Opportunities and Inclusion Activities Undertaken by the Department of Commerce.
Aspocomp’s Q1 Net Sales and Operating Result Decreased YoY
04/18/2024 | AspocompInflation and interest rates, weak economic development, the uncertainties posed by Russia’s war of aggression and the situation in the Middle East, and global trade policy tensions will affect the operating environment of Aspocomp and its customers in the 2024 fiscal year.
IDTechEx Explores the Role of 3D Cu-Cu Hybrid Bonding in Powering Future HPC and AI Products
04/18/2024 | PRNewswireSemiconductor packaging has evolved from traditional 1D PCB levels to cutting-edge 3D hybrid bonding at the wafer level, achieving interconnecting pitches as small as single micrometers and over 1000 GB/s bandwidth. Key parameters, including Power, Performance, Area, and Cost, are crucial considerations
SIA Applauds CHIPS Act Incentives for Samsung Manufacturing Projects in Texas
04/16/2024 | SIAThe Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer applauding semiconductor manufacturing incentives announced by the U.S. Department of Commerce and Samsung.
Renesas Commences Operations of Kofu Factory as Dedicated 300-mm Wafer Fab for Power Semiconductors
04/15/2024 | RenesasRenesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, today announced that it has started operations at its Kofu Factory, located in Kai City, Yamanashi Prefecture, Japan.