Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

Cadence Continues ‘Left Shift’ of SI Functions 

02/29/2024 | I-Connect007 Editorial Team
At DesignCon, the I-Connect007 Editorial Team met with Brad Griffin, product marketing group director for the System Analysis Group at Cadence Design Systems. Brad explains how this analysis tool enables designers to address SI and PI issues early in the design process, before they become costly errors, and why he believes his late co-worker Dennis Nagel would be proud to see his efforts come to fruition. 

Keysight, Intel Foundry Partner to Certify Electromagnetic Simulation Software for Intel 18A Process Technology

02/22/2024 | BUSINESS WIRE
Keysight Technologies, Inc. announces that the RFPro electromagnetic (EM) simulation software, part of the Keysight EDA Advanced Design System (ADS) integrated tool suite, is now certified by Intel Foundry for design engineers targeting Intel 18A process technology.

Beyond Design: Embedded Capacitance Material

02/22/2024 | Barry Olney -- Column: Beyond Design
Embedding components into the multilayer PCB substrate can have many benefits, including reduced board size and improved signal integrity. However, embedded capacitance material (which is not really a component but rather part of the substrate) can improve power integrity dramatically by reducing AC impedance and generally enhancing the performance of the product. It takes up no additional space, is easy to implement (because it is compatible with standard FR-4 processes), and can be cost-effective.

Altair Names EDA Expert Channel Partner for France

02/05/2024 | Altair
Altair, a global leader in computational science and artificial intelligence (AI), announced that EDA Expert has joined Altair’s growing channel partner network and will offer the full suite of Altair’s electronic design solutions, part of the Altair® HyperWorks® design and simulation platform.

BOOK EXCERPT: 'The Printed Circuit Designer’s Guide to... Stackups—The Design within the Design', Chapter 5

01/30/2024 | I-Connect007 Editorial Team
We are sharing this sample of 'The Printed Circuit Designer’s Guide to... Stackups—The Design within the Design,' by Bill Hargin, to give our readers a glimpse into the important topics that are covered in this book. He writes, "In my work, I deal with impedance and the entire ecosystem surrounding it daily. Whenever I talk to hardware teams, they often ask me the question of how two fabricators can come back with two totally different designs for the same target impedance.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in