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Seeking ways to prolong Moore's Law, semiconductor companies are turning to new advanced component packaging techniques and in-package substrates. These mix-and-match approaches, requiring PCB-like connections via interposers, are blurring the boundaries between printed circuit fabrication and semiconductor fabrication. Are there strategic opportunities–new directions in which to shift your business–in this new space? In this issue of PCB007 Magazine, we open the discussion about how advanced packaging will change the structure of our industry.
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