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Concerns over tin whiskers have intensified in recent years. Various research and studies have delivered burgeoning reports and have appeared in industry publications. The tin whisker issue, and its potential mishaps, has been recognized for more than six decades in electronic, electrical, and industrial applications. So, what is new?
This series will address the practical and pragmatic aspects of the tin whisker phenomenon with a light touch on scientific background. Before I delve into the gist of tin whiskers, several areas should first be clarified.
Read the full column here.
Editor's Note: This column originally appeared in the May 2013 issue of SMT Magazine.
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Since the introduction of the RoHS legislation in 2006, the threat of tin-whisker-related short circuit failure from pure tin finished components has remained a major concern within the high-reliability electronics manufacturing industry. In the second part of this two-part article series, Editor Pete Starkey concludes his review of the SMART Group's recent seminar, which is focused on tin whisker mitigation methodologies and strategies.
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