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Mentor Graphics White Paper: 10 Key Challenges In Electronics Thermal Design
July 21, 2015 | Mentor GraphicsEstimated reading time: 1 minute
Miniaturization of electronics is continuing to increase power densities at all packaging levels. Miniaturization arises from cost reduction, being the key driver in many industry sectors, resulting in increasingly tighter design margins and less tolerance of over-design. This is particularly true in the physical design of the product, where over-design results in additional weight, volume, and in some cases manufacturing and assembly costs, increasing the cost of the final product.
Removing heat is critical to the operation and long-term reliability of electronics. Component temperatures within specification are the universal criteria used to determine the acceptability of a design. Cooling solutions directly add weight, volume, and cost to the product, without delivering any functional benefit. What they provide is reliability. Without cooling, most electronics products would fail in a matter of minutes. Leakage current and thus leakage power goes up with smaller die-level feature sizes, and because leakage is temperature-dependent, thermal design is more important, as is the need to preserve power for Internet-of-Things (IoT) connected devices.
How, then, should engineering managers in organizations engaged in developing products that include complex and/or high-power electronics ensure the thermal performance of their products while meeting other design criteria?
To answer this question, we explore the following 10 key challenges in electronics thermal design.
Click here to download the white paper.Suggested Items
IPC Bestows Posthumous Hall of Fame Award to Industry Icon Michael Ford
04/18/2024 | IPCIPC honored the late Michael Ford, Aegis Software, for his extraordinary contributions to the global electronics manufacturing industry with the IPC Raymond E. Pritchard Hall of Fame Award at IPC APEX EXPO 2024. IPC’s most prestigious honor, the Hall of Fame Award is given to individuals who have provided exceptional service and advancement to IPC and the electronics industry. Ford, an industry leader and valued IPC volunteer, died suddenly in January 2024.
SEMI Applauds U.S. Chips Act Award for Samsung Electronics Facilities to Strengthen Domestic Semiconductor Supply Chain
04/17/2024 | SEMISEMI, the industry association serving the global electronics design and manufacturing supply chain, applauded the United States Department of Commerce’s announcement of a Preliminary Memorandum of Terms for an award under the CHIPS and Science Act to support the expansion of Samsung Electronics’ presence in Texas and the company’s development and production of leading-edge chips.
Northrop Grumman honors Calumet Electronics with Supplier Excellence Award
04/17/2024 | Calumet ElectronicsNorthrop Grumman Corporation has recognized Calumet Electronics during the company’s 2024 Supplier Excellence Awards for “exceptional performance and unwavering commitment to delivering with excellence.” Calumet is one of 70 suppliers recognized from across the globe. In its award category of “Supplier Strategic Excellence,” Calumet was honored alongside global corporations such as Amazon Web Services, Dell Technologies, and Eaton Corporation.
Ark Electronics Expands Global Manufacturing Factory Network in North America and Europe
04/17/2024 | PRNewswireElectronic Manufacturing Company Ark Electronics recently announced the expansion of its Global Factory Network with the addition of Electronics Manufacturing Service (EMS) capabilities in Mexico and Europe.
Designing Electronics for High Thermal Loads
04/16/2024 | Akber Roy, Rush PCB Inc.Developing proactive thermal management strategies is important in the early stages of the PCB design cycle to minimize costly redesign iterations. Here, I delve into key aspects of electronic design that hold particular relevance for managing heat in electronic systems. Each of these considerations plays a pivotal role in enhancing the reliability and performance of the overall system.