2015’s Most Read PCB Articles


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EIPC Summer Conference, Berlin

The 2015 EIPC Summer Conference attracted delegates to Berlin from sixteen countries to experience 21 technical presentations over two days. Also included was a visit to the Berlin laboratories of Fraunhofer Institute, Europe’s largest application-oriented research organization.

HDPUG Demonstrates Benefits of Cooperative R&D

The High-Density Packaging User Group (HDPUG) is a member-driven, non-profit, project-oriented industry consortium that addresses the integration of new electronics component packaging and interconnection technologies into the supply chains of its member companies.

Raising a Unified Voice for an Advanced Manufacturing Economy

The electronics manufacturing industry is an important sector in the global economy, and John Hasselmann, VP of Government Relations at IPC, is an advocate for policies that will help our industry as well as the prosperity and welfare of billions of people.

Characterization of PCB Material & Manufacturing Technology for High-Frequency

Concepts like Industry 4.0, Internet of Things, M2M communication, smart homes and communication in, or to cars are maturing. All these applications are based on the same demanding requirement— a considerable amount of data and increased data transfer rate. the aim of this paper is to develop a concept to use materials in combination with optimized pcB manufacturing processes, which allows a significant reduction of losses and increased signal quality.

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Optimize Your Etcher for Best Image Quality

11/03/2022 | Christopher Bonsell, Chemcut
When it comes to obtaining high-quality images, many different factors come into play. Typically, most of these factors come down to your imaging equipment and cleanroom; however, there are factors involved in the etching process that can affect the quality of your image. Here are five steps to ensure your etching process is optimized for the best image quality.

Millennium Circuits on The Move

10/31/2022 | Andy Shaughnessy, Design007 Magazine
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EIPC Technical Snapshot: ‘Tremendous Uncertainty’ in Global PCB Marketplace

10/26/2022 | Pete Starkey, I-Connect007
For the past two years, EIPC’s Technical Snapshot series has kept us extremely well-informed on developments in printed circuit materials and manufacturing technologies. But what is currently happening in the global PCB market, and how is Europe and the rest of the world affected by the current world situation? The 19th chapter (coincidentally on Oct. 19) in the series gave us a privileged opportunity to find out, as two leading industry analysts presented their observations and opinions in a webinar introduced and moderated by EIPC technical director Tarja Rapala-Virtanen.



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