Mentor Paper: Take Command of Thermal Optimization During PCB Design


Reading time ( words)

Computational fluid dynamics software tools can be useful in considering the effect on a printed circuit board of such things as package selection, board layout and structure as well as enclosure design.

This Mentor Graphics white paper explains: 

  • Approaches to PCB thermal management studies with CFD
  • Automating PCB thermal design modifications using Design of Experiments
  • Utilizing parametric studies to explore a range of operating scenarios early in the design process
  • Example: Heatsink optimization for cPCI card for cost-effective design
  • Tradeoffs: Heat sink geometry & mass vs component allowable temperature ranges and layout
To download this paper, click here.


Share




Suggested Items

DownStream Flexes in Rigid-Flex

11/14/2022 | Andy Shaughnessy, Design007 Magazine
During PCB West, I caught up with DownStream Technologies co-founder Joe Clark and Senior Product Marketing Manager Mark Gallant. We discussed some of their latest tool updates, including a greater focus on bringing post-processing functionality, such as inter-layer analysis capability, to rigid-flex circuits. Joe also offered a look at global design trends going into 2023, as more engineers take on PCB designer roles while senior designers are retiring.

Sunstone’s Matt Stevenson Shares Insights From New PCB Design Book

10/27/2022 | Nolan Johnson, I-Connect007
There’s designing the “perfect” circuit board and then there’s designing a board that is “perfect for manufacturing.” While seasoned designers and design engineers understand many of the nuances, PCB fabricator Sunstone Circuits has just published a new book specifically for new designers who have the knowledge of design but are still learning what it means to get the board manufactured. Sunstone’s Matt Stevenson takes the reader through a series of situations that should help clarify what’s happening in the fabrication process and how to adjust a board design to be better suited for manufacturing.

Forming Standards for Ultra HDI

10/25/2022 | Andy Shaughnessy, Design007 Magazine
To get the latest news about ultra high-density interconnections (UHDI), we checked in with Jan Pedersen, NCAB Group’s director of technology. Jan is co-chair of IPC D-33AP, and a great source of overall DFM expertise as well. We asked him to give us a snapshot of UHDI in the industry, where we’re headed, and what this means to PCB designers.



Copyright © 2022 I-Connect007 | IPC Publishing Group Inc. All rights reserved.