I-Connect007 Editor’s Choice: Five Must-Reads for the Week

January 27, 2023 | Nolan Johnson, I-Connect007

This week, the IPC APEX EXPO event has cast a long shadow across the news feeds. No, that’s not the right metaphor. No, not a shadow; shadows are dark. It would be more accurate to say IPC APEX EXPO cast a beam of illumination upon the news feeds for the electronics manufacturing industry. To that end, the APEX EXPO news makes a prominent appearance in this week’s editor’s picks.

Advanced Packaging Means Advanced Routing Issues

January 26, 2023 | Kris Moyer, IPC

In today’s ever-shrinking world of electronics designs, the use of BGA parts with very fine pitch features is becoming more prevalent. As these fine-pitch BGAs continue to increase in complexity and user I/O (number of balls), the difficulty of finding escape routes and fan-out patterns increases. Additionally, with the shrinking of silicon geometry leading to both smaller channel length and increased signal integrity issues, some of the traditional BGA escape routing techniques will require a revisit and/or adjustment to allow for not only successful fan-out, but also successful functioning of the circuitry of the BGA design.



Sensible Design: Automotive Conformal Coating Applications

January 25, 2023 | Team Electrolube, Electrolube

Conformal coatings are all around us. The benefits they offer are discreet but intensely purposeful, as they protect electronic circuitry against harsh environments and help to extend the reliability and lifetime of our devices. With...

Fresh PCB Concepts: Designing Controlled Impedance PCBs

January 19, 2023 | Team NCAB, NCAB Group

Imagine that you are getting ready to work on a new PCB when the electronics engineer you work with suddenly gives you a controlled impedance requirement for the board. This will be your first experience designing a PCB with...

Tim’s Takeaways: Threading the Needle Through Advanced Packaging

January 18, 2023 | Tim Haag, First Page Sage

Last week my wife started a new project that required a trip to the craft store for supplies, and she invited me to join her on this errand. This is not the first time I’ve faced this scenario; do I choose to follow her around...

The Advanced Future Featuring:

  • Advanced Packaging Means Advanced Routing Issues, by Kris Moyer
  • A Challenge Facing Aerospace Designers in 2023, by Lee Ritchey
  • Threading the Needle Through Advanced Packaging, by Tim Haag
  • Advanced Packaging Not a Passing Fad, by John Watson
  • Scaling Beyond Silicon, by Ashutosh Mauskar
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